The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 1998

Filed:

Apr. 08, 1997
Applicant:
Inventors:

Daryl J Nelson, Beaverton, OR (US);

Duncan D MacGregor, Shingle Springs, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 64 ; 439946 ;
Abstract

An improved printed circuit card for add in functions for computer systems which adds bandwidth to such cards through additional bus type connectors without changing the form factor. The basic card add in system consist of a card having a printed circuit board surrounded and supported by a frame. A connector socket is mounted to the frame and electrically connected to the printed circuit board. The card has top and bottom covers attached to the frame which enclose the printed circuit board and a portion of the socket. The portion of the existing system located in the host consists of a header which is electrically and mechanically connected to the mother board in the digital computer system. The header has a connector which is electrically connected to the mother board and is adapted to mate with the connector socket in the card. The card and header conform to the PCMCIA standard. Up to 34 electrically conductive and mechanically deformable interconnects are mounted on one or both sides of the card substantially adjacent to the connector and electrically connected to the printed circuit board. The interconnects are accessible through the covers of the card. On the header, a plurality of electrically conductive interconnects are mounted and electrically connected to the mother board and positioned to make electrical contact with the interconnects mounted on the card when the card is inserted into the header. The form factor of the card and position of the connector remains unchanged.


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