The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 1998

Filed:

Jul. 12, 1996
Applicant:
Inventors:

Michael Anthony Gaynes, Vestal, NY (US);

Jaynal Abedin Molla, Chandler, AZ (US);

Steven Paul Ostrander, Scotai, NY (US);

Judith Marie Roldan, Ossining, NY (US);

George John Saxenmeyer, Apalachin, NY (US);

George Frederick Walker, New York, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 91 ;
Abstract

Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.


Find Patent Forward Citations

Gaynes, Michael. (1998). Selectively filled adhesives for semiconductor chip interconnection and (U.S. Patent No. 5813870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5813870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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