The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 1998

Filed:

Apr. 25, 1997
Applicant:
Inventors:

Lin-June Wu, Hsinchu, TW;

Jau-Jey Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438622 ; 438631 ; 438633 ; 438975 ;
Abstract

The present invention is a method of protecting an alignment mark in semiconductor manufacturing process with CMP. This invention utilizes a via mask or masking blade to remove the intermetal dielectric layer on a wide clear -out window using two etching steps. One etching step is performed before intermetal dielectric layer polish. The other etching step is performed after intermetal dielectric layer polish. Thus, there is no intermetal dielectric layer remained on the alignment mark and the alignment mark keeps the original shape.


Find Patent Forward Citations

Wu, Lin-June. (1998). Method of protecting an alignment mark in a semiconductor manufacturing (U.S. Patent No. 5801090). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5801090

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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