The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 1998
Filed:
Mar. 05, 1997
Koichi Tanaka, Nishi-shirakawa-gun, JP;
Toshihiro Tsuchiya, Nishi-shirakawa-gun, JP;
Koji Morita, Nishi-shirakawa-gun, JP;
Tsutomu Takaku, Nishi-shirakawa-gun, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A polishing system for polishing a wafer or the like, comprises: a vacuum system comprising a vacuum pump and a vacuum passage connected thereto; a fluid supply system comprising a fluid source and a fluid passage connected thereto; a polishing head comprising a holding member for holding the wafer or the like on the lower surface thereof which has at least one through hole in communication with the vacuum passage and the fluid passage; and a polishing member. Polishing of the wafer or the like is performed by pressing the wafer or the like held on the lower surface of the holding member, against the polishing member while providing relative motion between the holding member and the polishing member and supplying an abrasive slurry to the polishing member. Separation of the wafer or the like from the polishing head is performed by injecting a fluid from the fluid supply system to the object through the through hole of the holding member. A gelation suppression member for suppressing gelation of the abrasive slurry sucked into the through hole or the vacuum passage is provided in the course of the vacuum passage.