The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 1998

Filed:

Nov. 04, 1993
Applicant:
Inventors:

Kiyohiro Furutani, Hyogo, JP;

Hideyuki Ozaki, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K / ;
U.S. Cl.
CPC ...
327374 ; 327170 ; 327389 ;
Abstract

An improved output driver circuit for a semiconductor integrated circuit device is provided. The output driver circuit receives a type select signal (.phi.1,/.phi.1) determined by bonding selection. When a heavy load circuit is connected to an output terminal (DQ), a signal (.phi.1) of low level and a signal (/.phi.1) of high level are provided, whereby transistors (18, 19) are turned on simultaneously in response to a data signal (Mo). When a light load circuit is connected to the terminal (DQ), a signal (.phi.1) of high level and a signal (/.phi.1) of low level are provided, whereby transistors (18, 19) are turned on at a different timing. More specifically, following charging of a light load by a transistor (18) having low mutual conductance, a transistor (19) is turned on. Therefore, noise generation can be flexibly suppressed by bonding selection.


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