The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1998
Filed:
Sep. 16, 1996
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An integrated circuit having an outer ring of bonding pads which is positioned so as to be adjacent to and concentric with the perimeter of the integrated circuit. The outer ring of bonding pads extends for at least a first portion of the perimeter. An inner ring of bonding pads is positioned interior of, adjacent to, and concentric with the first ring of bonding pads. The inner ring of bonding pads extends for at least a second portion of the perimeter. The first portion is greater than the second portion, or in other words, the outer ring of bonding pads extends further around the integrated circuit than the inner ring of bonding pads. In addition, the outer ring of bonding pads has a greater number of bonding pads that the inner ring of bonding pads. Traces are electrically connected to the bonding pads of the inner and outer rings, such that each pad is electrically connected to a unique trace, meaning that each pad has a trace which is associated with just that pad and with no other pad. The pads of the inner and outer rings are staggered such that adjacent pads of the inner ring are separated by at least two of the traces which are connected to pads of the outer ring. By staggering the inner and outer rings of pads in this manner, pad density, ease of manufacture, and reliability are increased. By having the rings of pads progress around only a first and second portion of the perimeter of the integrated circuit, no space is taken up by bonding pads that are not required. For example, the outer ring of pads may extend all the way around the perimeter of the integrated circuit, and the inner ring of pads may only extend half way around the perimeter of the integrated circuit, because additional bonding pads are not required by the circuit.