The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1998
Filed:
Sep. 09, 1997
Applicant:
Inventors:
William Thomas Motsiff, Essex Junction, VT (US);
Robert Michael Geffken, Burlington, VT (US);
Ronald Robert Uttecht, Essex Junction, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438618 ; 438622 ; 438623 ; 438626 ; 438627 ; 438688 ; 438687 ; 438642 ;
Abstract
A semiconductor interconnection consists of a corrosion resistant integrated fuse and Controlled, Collapse Chip Connection (C4) structure for the planar copper Back End of Line (BEOL). Non copper fuse material is directly connected to copper wiring.
Motsiff, William. (1998). Integrated pad and fuse structure for planar copper metallurgy (U.S. Patent No. 5795819). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5795819
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile