The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1998
Filed:
Sep. 16, 1996
Applicant:
Inventor:
Mirek Boruta, Castro Valley, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438462 ; 438465 ; 83861 ; 83875 ; 125 12 ; 225-2 ;
Abstract
A method of cutting a plate-like wafer, particularly a semiconductor wafer, while removing a deposited material from along a scribe line. The deposited material having a width generally greater than the width of the saw blade. The method includes making one scribing cut to one side of the scribe line, making a second scribing cut to the other side of the scribe line, and making a severing cut along the scribe line to dice the wafer.