The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1998
Filed:
May. 01, 1995
Samuel J Anderson, Tempe, AZ (US);
Guillermo L Romero, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of fabricating a multi-chip package including an aluminum silicon substrate with an aluminum nitride layer thereon forming an electrically insulated surface and aluminum heat conductive areas positioned on the insulated surface. Conductors on the surface of the substrate defining mounting areas and external connections with each mounting area positioned adjacent an associated one of the heat conductive areas and a semiconductor chip mounted in each mounting area. Heat conductive elements connected to the rear surface of each chip and to the associated one of the plurality of heat conductive areas, and each chip encapsulated with reworkable encapsulant.