The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1998
Filed:
Jul. 19, 1996
T P Ong, Austin, TX (US);
Robert W Fiordalice, Austin, TX (US);
Ramnath Venkatraman, Austin, TX (US);
Elizabeth J Weitzman, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A process for fabrication of a metallized interconnect structure includes the formation of an inlaid interconnect (42) overlying an aluminum layer (34). The inlaid interconnect (42) is formed within an interlevel dielectric layer that is processed to contain an interconnect channel (24) and a via opening (14) residing at the bottom of the interconnect channel (24). The aluminum layer (34) is selectively deposited to at least partially fill the via opening (14) at the bottom of an interconnect channel (24). An adhesion layer (36) is deposited to overlie the aluminum layer (34) within the via opening (14), and a second aluminum layer (38) is blanket deposited and planarized to form the inlaid interconnect (42) in the interconnect channel (24).