The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1998
Filed:
Oct. 25, 1996
Michio Osada, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Towa Corporation, Uji, JP;
Abstract
A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.