The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1998
Filed:
May. 30, 1996
Kohei Toyama, Shirakawa, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A slicing method of the type using a wire saw slicing apparatus including a plurality of main rollers rotatably supported at their opposite ends by pairs of bearing units and parallel spaced at predetermined intervals, and a wire wound spirally over and around the main rollers at a predetermined pitch so as to form a number of laterally spaced lines of wire stretched across a slicing zone defined between two adjacent ones of the main rollers, in which a workpiece such as a silicon semiconductor single crystal ingot is sliced into wafer-like pieces as it is forced against the lines of wire running across the slicing zone while the main rollers are rotating, with a slurry continuously supplied to the lines of wire in the slicing zone, characterized in that the main rollers are displaced in the axial direction while the workpiece is being sliced. With this axial displacement of the main rollers, the wafers as sliced from the workpiece have a controlled amount of 'sori' (warp or bow). The slicing method is carried out by a wire saw slicing machine including means for displacing the main rollers in the axial direction while the workpiece is being sliced.