The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1998
Filed:
Dec. 26, 1995
Douglas G Mitchell, Tempe, AZ (US);
Francis J Carney, Gilbert, AZ (US);
Eric J Woolsey, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An interconnect system (31) includes an interconnect bump (29) over an under bump metallurgy (25). The under bump metallurgy (25) includes a barrier layer (26) having a barrier material such as titanium, an adhesion layer (28) having an adhesion material such as copper, and a mixture layer (27) having both the barrier material and the adhesion material. The mixture layer (27) is located between the barrier layer (26) and the adhesion layer (28), and the adhesion layer (28) is located between the mixture layer (27) and the interconnect bump (29). The interconnect bump (29) contains solder and is used as an etch mask when patterning the under bump metallurgy (25).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile