The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Nov. 12, 1996
Francis Richard Bronson, High Ridge, MO (US);
MEMC Electronic Materials, Inc., St. Peters, MO (US);
Abstract
A method for mounting a semiconductor wafer on a polishing block to hold the semiconductor wafer during polishing. The method comprises the steps of providing a polishing block having a surface for mounting the semiconductor wafer and providing a heater comprising a heater body and a thermally conductive buffer plate which is selectively moveable with respect to the heater body between a pre-heating position in which the plate is spaced from the heater body and a heating position in which the plate contacts the heater body. A bonding agent is applied to the polishing block surface. The polishing block is placed on the buffer plate when the buffer plate is positioned in the pre-heating position and the buffer plate is moved from the pre-heating position to the heating position to heat the buffer plate, the polishing block and the bonding agent. The buffer plate is held in the heating position with the polishing block on the buffer plate for a period of time sufficient to prepare the bonding agent and the semiconductor wafer is applied to the prepared bonding agent.