The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Jun. 13, 1996
Applicant:
Inventors:
Makoto Kimura, Kodaira, JP;
Shinji Tojo, Higashimurayama, JP;
Takahiro Fujioka, Mobara, JP;
Akihiko Narisawa, Kodaira, JP;
Yoshiyuki Tanigawa, Higashimurayama, JP;
Shinya Kanamitsu, Brisbane, CA (US);
Koji Akimoto, Tachikawa, JP;
Hiroyuki Mouri, Kunitachi, JP;
Assignees:
Hitachi, Ltd, Tokyo, JP;
Hitachi Device Engineering Corp, Chiba, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; G09G / ;
U.S. Cl.
CPC ...
257668 ; 257666 ; 257676 ; 257673 ;
Abstract
To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.