The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 1998

Filed:

Apr. 10, 1997
Applicant:
Inventors:

Masaaki Yasunaga, Mitaka, JP;

Takeshi Kagamida, Mitaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156584 ; 156344 ; 294265 ;
Abstract

The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water tank into the hot water. The clamper is placed at the upper of the clamp base and the substrate portion of the wafer is pushed to the clamp base fixedly and the pusher is arranged at the upper side of the clamp base in the vicinity of the clamper so as to push the slice base of the wafer, whereby the slice base is peeled. The peeling is performed in the hot water, therefore, the temperature of the wafer does not lower while peeling, so that the adhesive can be peeled easily.


Find Patent Forward Citations

Yasunaga, Masaaki. (1998). Wafer slicer base peeling system (U.S. Patent No. 5759344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5759344

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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