The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1998
Filed:
Dec. 18, 1995
Lonne L Mays, Gilbert, AZ (US);
Jean-Baptiste Martin, Toulouse, FR;
Hiep M Le, Phoenix, AZ (US);
James G Lippmann, Phoenix, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor diode device (10) includes two heatsinks (11, 12), a semiconductor substrate (15) having a p-n junction (35) and located between the two heatsinks (11, 12), solder (13, 14) between the heatsinks (11, 12) and the semiconductor substrate (15), and a packaging material (16) covering the semiconductor substrate (15), the solder (13, 14), and a portion of the two heatsinks (11, 12). The two heatsinks (11, 12) each have a curved surface (21, 22), which reduces tilting of the semiconductor substrate (15), reduces temperature gradients across surfaces (23, 24) of the semiconductor substrate (15), and improves the reliability of the semiconductor diode device (10). The two heatsinks (11, 12) also include protrusions (19, 20), which help to keep the packaging material (16) covering the curved surfaces (21, 22) of the heatsinks (11, 12).