The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1998
Filed:
Aug. 09, 1996
Toshikazu Takenouchi, Nagano, JP;
Mikiko Wakabayashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A multilayer circuit board includes a plurality of substrates. Each of the substrates includes a thermosetting resin film having respective surfaces, a metal layer formed on the one of the surfaces and a thermoplastic polyimide film formed on the other surface. Each of the substrates has at least one via hole, which is filled with thermoplastic polyimide resin containing electrically conductive material to form an electrically conductive via. The metal layer is defined as a predetermined circuit pattern electrically connected to the via. The plurality of substrates are laminated in such a manner that the substrate is adhered to an adjacent one by means of the thermoplastic polyimide film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile