The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1998
Filed:
Jan. 29, 1997
Applicant:
Inventor:
William Yueh, Fullerton, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451287 ; 451285 ; 451288 ; 451 41 ;
Abstract
Semiconductor wafer polishing apparatus, in accordance with the princples of this invention, includes an annular-shaped platen rotatable about a non-rotating center core having a diameter smaller than the width of the annular-shaped platen. The center core is the source of slurry which permits convenient dispensing of slurry. The apparatus includes a bridge which extends from the center core to the rigid table in which the apparatus is housed. The bridge is a convenient support for apparatus for pad rejuvenation and for sensing and correcting wafer attitude and characteristics as well as slurry properties on a real time basis for improving wafer uniformity and local surface planarity.