The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 1998
Filed:
Jun. 07, 1995
Noriaki Fujiki, Hyogo, JP;
Takashi Yamashita, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In a semiconductor device having a bonding pad structure of a multilayered wiring structure comprising a first wiring layer and a second wiring layers which is located over the first wiring layer and an interlayer insulation layer between the wiring layers which has an electrically conductive component so as to electrically connect the wiring layers, the bonding pad structure is such that no crack is formed in the interlayer insulation layer during wire bonding. The bonding pad structure is so arranged that an area of the first wiring layer area is smaller than that of the second wiring layer or the first wiring layer is formed outside a bonding region of the second wiring layer under the second wiring layer.