The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1998
Filed:
Mar. 22, 1996
Timothy E White, Acton, MA (US);
Neal R Butler, Acton, MA (US);
Marcus Hatch, Waltham, MA (US);
Kenneth R Erikson, Lexington, MA (US);
Curtis A Vock, Salem, MA (US);
Wayne C Haase, Acton, MA (US);
Michael A Martinelli, Winchester, MA (US);
Lockheed Martin IR Imaging Systems, Inc., Lexington, MA (US);
Abstract
An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.