The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1998

Filed:

Jan. 13, 1997
Applicant:
Inventors:

Makoto Iijima, Kawasaki, JP;

Tetsushi Wakabayashi, Kawasaki, JP;

Toshio Hamano, Kawasaki, JP;

Masaharu Minamizawa, Kawasaki, JP;

Masashi Takenaka, Kawasaki, JP;

Taturou Yamashita, Satsuma-gun, JP;

Masataka Mizukoshi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 174250 ; 174252 ; 257707 ; 257713 ; 361715 ; 361717 ;
Abstract

A semiconductor device includes a board base having through-holes filled with a filling core, and an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths. The semiconductor device further includes a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a passage restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.


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