The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 1998
Filed:
Mar. 06, 1996
Junzo Fukuta, Nagoya, JP;
Toshihiro Nakai, Nagoya, JP;
Sumitomo Metal (SMI) Electronics Devices Inc., Yamaguchi, JP;
Abstract
A conductive paste for filling through holes for the interlayer electrical connection in a low-temperature firable ceramic circuit substrate to be fired at 800.degree. to 1,000.degree. C., which comprises a) 100 parts by weight of flaky and/or spherical silver-based powder particles; b) 0.1 to 2.0 parts by weight of b.sub.1) Sb.sub.2 O.sub.3 or a substance which is converted into Sb.sub.2 O.sub.3 by the firing and the amount of which is given in terms of Sb.sub.2 O.sub.3 and/or b.sub.2) Rh powder; and c) at least 3 parts by weight of 2-tetradecanol. The conductive paste has excellent printing properties and homogeneity because the viscosity change thereof is only small when it is printed into through holes of a ceramic circuit substrate and the crack formation after the firing is slight. Thus, the conductive paste is effective for efficient production of a ceramic circuit substrate of a high density wiring. The conductive paste may contain at least one organic resin selected from the group consisting of ethylcellulose, hydroxyethylcellulose and an acrylic resin.