The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 1998
Filed:
Dec. 20, 1995
Mark J Palmer, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit package which has vias that provide the dual function of electrically grounding an integrated circuit and removing heat generated by the circuit. The package has a bonding shelf extending from a base portion. The bonding shelf has a plurality of bonding pads that are connected to corresponding pads on a top surface of the integrated circuit. The integrated circuit is mounted to the base portion of the package. The base portion has a plurality of surface pads that are connected to corresponding ground pads on the integrated circuit. Located between the base portion and an external bottom surface of the package is a ground bus. The package has a plurality of vias that electrically connect the surface pads and integrated circuit to the ground bus. The vias further extend to the external bottom surface to provide a thermal path between the integrated circuit and the outside of the package.