The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1998
Filed:
Oct. 02, 1996
Applicant:
Inventors:
Herbert Carl Cook, Jericho, VT (US);
Paul Alden Farrar, Sr, South Burlington, VT (US);
Robert Michael Geffken, Burlington, VT (US);
William Thomas Motsiff, Essex Junction, VT (US);
Adolf Ernest Wirsing, South Hero, VT (US);
Assignee:
International Business Machines Corporaton, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437183 ; 437189 ; 437192 ; 437201 ;
Abstract
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.