The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 1998

Filed:

Nov. 22, 1994
Applicant:
Inventors:

Kohichi Tanaka, Fukushima-ken, JP;

Hiromasa Hashimoto, Fukushima-ken, JP;

Fumio Suzuki, Fukushima-ken, JP;

Assignee:

Shin-Etsu Handotai, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451288 ; 451449 ; 451488 ;
Abstract

A polishing machine for polishing a flat workpiece such as a semiconductor wafer has a rotatable reference table supporting an abrasive cloth disposed on a surface thereof, and a rotatable workpiece holder for holding a flat workpiece against the abrasive cloth. While the flat workpiece is being polished by the abrasive cloth, an abrasive compound is supplied between the abrasive cloth and the flat workpiece. The reference table has grooves defined therein for dissipating heat from the reference table and the abrasive cloth while the flat workpiece is being polished by the abrasive cloth. The grooves may be supplied with either the abrasive compound or a coolant.


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Tanaka, Kohichi. (1998). Polishing machine and method of dissipating heat therefrom (U.S. Patent No. 5718620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5718620

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