The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 1998

Filed:

Nov. 27, 1996
Applicant:
Inventors:

Michinori Komagata, Niigata, JP;

Kiminori Yokoyama, Niigata, JP;

Yoshinobu Tanaka, Niigata, JP;

Kenichi Suzuki, Niigata, JP;

Assignee:

Namics Corporation, Niigata, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; H01B / ;
U.S. Cl.
CPC ...
428208 ; 428206 ; 428328 ; 428414 ; 428416 ; 428901 ; 523200 ; 523210 ; 523427 ; 523442 ; 525474 ; 525481 ; 525489 ; 25251914 ; 25251921 ; 25251933 ; 25251934 ; 2525212 ; 2525215 ; 156330 ;
Abstract

There is disclosed a conductive adhesive comprising (A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof; (B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and (C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.


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