The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1998
Filed:
Feb. 18, 1997
Yuichi Satsu, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Mineo Kawamoto, Hitachi, JP;
Akio Takahashi, Hitachioota, JP;
Masashi Miyazaki, Hadano, JP;
Toshiaki Ishimaru, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.