The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 1998
Filed:
May. 31, 1996
Anthony Paul Ingraham, Endicott, NY (US);
William Tze-You Chen, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A dendrite surface is provided on each of the electrical contacts of a substrate, such as a test board, chip carrier, or printed wiring board. The electrical contacts on the substrate are arranged in a mirror image of the input/output pads on a wirebond chip from which the wire leads have been removed from, or not initially provided on, each of the input/output pads. The wirebond chip is aligned with the substrate, and the respective contact brought into electrical communication with each other. The wirebond chip may be removed after testing or other temporary attachment purpose, or permanently encapsulated with at least a portion of the substrate in a permanent assembly. The present invention permits wirebond chips to be selectively attached temporarily or permanently, i.e., have a pluggable capability, as well as the ability to allow a full array of I/O pad design.