The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 1997

Filed:

Oct. 10, 1995
Applicant:
Inventors:

Toyohisa Hiroki, Chiba, JP;

Tadashi Suzuki, Saitama-ken, JP;

Assignees:

Toska Co., Ltd., Tokyo, JP;

Optec Co., Ltd., Saitama-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264318 ; 249 63 ; 249152 ; 264334 ; 425577 ; 425D / ; 425D / ;
Abstract

A molded article having a large undercut part is efficiently produced by a method of molding a synthetic resin with the use of an apparatus comprising an outer mold (S) and an inner mold (N) arranged so as to form a cavity (C) inside the outer mold (S), said inner mold (N) comprising a central mold segment having a part whose size is reduced toward its head and mold segments (6, 7) for forming an inner surface of a molded article which are supported so as to be able to meet and get apart from each other around the central mold segment (4) and divided into a plurality of separate segments, wherein said mold segments for forming the inner surface of the molded article are rendered movable toward the center of the apparatus by moving the central mold segment and wherein the inner mold (N) is withdrawn in the form of its size reduced as a whole from inside the molded article (21) supported in the outer mold (S).


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