The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 1997
Filed:
Oct. 25, 1996
Applicant:
Inventors:
Tomohiro Taruno, Osaka, JP;
Yoshio Toyoda, Osaka, JP;
Hirofumi Ohno, Osaka, JP;
Shoichi Kimura, Osaka, JP;
Hiroyuki Asao, Osaka, JP;
Shinichi Kanai, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
264272 ; 26427213 ; 26432817 ; 2643285 ; 26433112 ; 437212 ; 525481 ; 525523 ; 528 87 ; 528501 ; 528502 ; 428543 ;
Abstract
A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.