The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 1997
Filed:
Nov. 20, 1996
Applicant:
Inventors:
Valery M Dubin, Cupertino, CA (US);
Yosi Schacham-Diamand, Ithaca, NY (US);
Bin Zhao, Irvine, CA (US);
Prahalad K Vasudev, Austin, TX (US);
Chiu H Ting, Saratoga, CA (US);
Assignees:
Cornell Research Foundation, Inc., Ithaca, NY (US);
Sematech, Inc., Austin, TX (US);
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ;
U.S. Cl.
CPC ...
427 96 ; 427 98 ; 427437 ; 4274431 ; 437192 ; 437195 ; 437230 ;
Abstract
A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.
Published as: