The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 1997

Filed:

Dec. 20, 1995
Applicant:
Inventor:

Mark J Palmer, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257692 ; 257697 ; 257773 ; 361772 ; 361791 ;
Abstract

A contact pattern for an integrated circuit package. The package has a plurality of contacts that are soldered to corresponding pads of a printed circuit board. The contacts are arranged into a plurality of cell units. Each cell unit has a row of center contacts diagonally located between two rows of outer contacts. The diagonally located pins increase the density of the contact pattern. Each unit cell is separated by a space that allows routing traces to be routed therethrough. Routing traces may also be routed through the unit cells to increase the routing density of the package. The package provides a contact pattern that optimizes both the pin density and the routing traces.


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