The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 1997
Filed:
Dec. 18, 1995
Applicant:
Inventors:
Michael D Evans, Wilmington, MA (US);
Tae Yong Kim, Boxford, MA (US);
Henry Miles O'Bryan, Jr, Plainfield, NJ (US);
Assignee:
Lucent Technologies Inc., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; C23C / ; B23K / ;
U.S. Cl.
CPC ...
427555 ; 427 97 ; 427 99 ; 427124 ; 427125 ; 4273762 ; 427531 ; 20419217 ; 216 17 ; 216 65 ; 21912171 ;
Abstract
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.