The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 1997
Filed:
Dec. 15, 1994
Applicant:
Inventors:
Tetsuo Matsuda, Poughkeepsie, NY (US);
Katsuya Okumura, Poughkeepsie, NY (US);
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437225 ; 437231 ; 437238 ; 437235 ; 437240 ; 437245 ; 437249 ;
Abstract
The present invention relates to a simple, low cost planarization technique whereby physical pressure is used to planarize the surface of a semiconductor device. The method of the present invention planarizes a semiconductor workpiece surface and results in an increase in the productivity of the processing steps that follow. In effect, the present invention applies physical pressure to flatten the surface layers of a semiconductor workpiece. The present invention is particularly adapted for use in planarizing surface layers made of plastic materials.