The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 1997
Filed:
Jul. 26, 1995
Kouhei Shimoda, Itami, JP;
Hirohiko Nakata, Itami, JP;
Abstract
A metallized ceramic substrate having a smooth plating layer comprises a ceramic substrate containing aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate; and a nickel-based plating layer formed on the metallized layer wherein the plating layer has a thickness of not greater than 2 .mu.m and a surface roughness (Ra) of not greater than 2 .mu.m. Alternatively, the plating layer on the ceramic substrate may comprise a first nickel-based plating layer having a thickness of not greater than 2 .mu.m and a second gold-based plating layer having a thickness of not greater than 1 .mu.m wherein the gold-based plating layer has a surface roughness (Ra) of 2 .mu.m or less. These metallized substrates are produced by applying a metallizing paste containing tungsten and/or molybdenum onto a green aluminum nitride ceramic substrate, flattening the metallizing paste layer, firing the metallizing paste-coated ceramic substrate, and forming the plating layer or layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile