The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 1997
Filed:
Jul. 24, 1995
William H Lytle, Chandler, AZ (US);
Treliant Fang, Chandler, AZ (US);
Jong-Kai Lin, Chandler, AZ (US);
Ravinder K Sharma, Mesa, AZ (US);
Naresh C Saha, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of forming an electrically conductive polymer bump (22) over an aluminum electrode (21) produces low contact resistance for an interconnect structure (24). Aluminum oxide is first removed from the aluminum electrode (21). Tiron and palladium are subsequently bonded to the fresh surface of the aluminum electrode (21). Finally, the electrically conductive polymer bump (22) is formed over the aluminum electrode (21). The Tiron and palladium improve the electrical contact between the conductive polymer bump (22) and the aluminum electrode (21) thereby reducing the contact resistance. The Tiron also inhibits corrosion of the aluminum electrode (21) and enhances the conductivity by catalytically shrinking the cyanate ester conductive bump.