The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Sep. 29, 1995
Applicant:
Inventors:
Seiichi Morimoto, Beaverton, OR (US);
Ebrahim Andideh, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451285 ; 451287 ; 451288 ;
Abstract
A method and apparatus for polishing a film formed over a semiconductor substrate. The substrate is pressed up against an abrasive pad so that the film contacts the pad. The pad has a diameter which is less than approximately two times a diameter of the substrate. While pressure is applied to the back of the substrate, the pad is rotated with respect to the wafer and an abrasive ceria slurry is introduced onto the pad to polish the film.