The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 1997
Filed:
Mar. 28, 1996
Hiroshi Kuriyama, Suwa, JP;
Youichi Kodaira, Suwa, JP;
Haruyuki Miyasaka, Suwa, JP;
Hideki Horiuochi, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A stamp unit and a method of preparing the same are provided in which a liquid photosensitive resin is used as the base material for stamp formation and the ease with which the material is handled during transportation, storage and stamp formation is facilitated. The stamp unit uses a liquid photosensitive resin which changes from liquid to solid upon receiving rays of light as the base material for stamp face formation. The stamp unit also includes a stamp stock, a liquid resin encapsulating section which is provided on the stamp face formation side of the stamp stock and which serves to encapsulate the liquid photosensitive resin in a state in which the resin can be exposed, an injection hole having one end open to the encapsulating space of the liquid resin encapsulating section and a second end open to the exterior, and a stopping member for stopping the injection hole to seal the liquid photosensitive resin in the liquid resin encapsulating section, wherein the liquid resin encapsulating section is constructed such that at least that portion thereof which covers the stamp face can be removed after stamp face formation.