Process for cleaning harmful gas

Abstract

There is disclosed a process for cleaning a harmful gas which comprises bringing a gas containing a basic gas as a harmful component such as ammonia and amines into contact with a cleaning agent comprising a cupric salt supported on an inorganic carrier composed of an metallic oxide such as silica and alumina or a metallic oxide mixture of cupric oxide and manganese dioxide to remove the harmful component from the gas containing a basic gas. According to the above process, it is made possible to effectively remove a basic gas such as ammonia and trimethylamine contained in the exhaust gas from semiconductor production process; and a harmful basic gas contained in dilution gas such as air or nitrogen which dilutes the harmful gas suddenly leaked in emergency from a gas bomb filled inside with the harmful gas. Moreover, the process enables to prevent the occurrence of fire even in the coexistence of other gas such as silane, while maintaining excellent effect on the removal of the harmful gas.