The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 1997
Filed:
Dec. 12, 1995
Youn Cheol Yoo, Seoul, KR;
Hee Yeoul Yoo, Seoul, KR;
Jeong Lee, Joongyang-Ku, KR;
Doo Hyun Park, Young Dung Po-Ku, KR;
In Gyu Han, Seoul, KR;
Anam Industrial Co., Ltd., Seoul, KR;
Amkor Electronics, Inc., Chandler, AZ (US);
Abstract
A chip mounting plate construction of lead frames for semiconductor packages which provides a chip mounting plate having a greatly reduced area to obtain a small bonding area between the chip mounting plate and a semiconductor chip mounted on the chip mounting plate, thereby capable of minimizing thermal strain generated at the chip mounting plate due to a thermal expansion thereof. The chip mounting plate is constructed to have a smaller area than the semiconductor chip, to have a central opening, or to have recesses.