The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 1997
Filed:
Jun. 17, 1994
Kiyoharu Inoh, Tokyo, JP;
Hisanaga Takano, Tokyo, JP;
Eiji Sumiya, Ohgaki, JP;
Akihiro Demura, Ohgaki, JP;
Yokogawa Electric Corporation, Tokyo, JP;
Ibiden Company, Limited, Ohgaki, JP;
Abstract
A laminating type molded coil and a method of fabricating the same comprising at least one coil substrate structure in which coils are formed on both sides of an insulating substrate by use of a printed wire technique, resin sheets disposed on both side of the coil substrate structure, and insulating covering sheets disposed on the outermost surfaces of the resin sheets, wherein when heated and subjected to pressure the spaces between the layers and between the coils are filled with resin from the resin sheets, and then hardened to produce an integral structure. Advantageously, because the coil pattern has a predetermined shape and is formed by printed wire techniques, the thickness of the coils may be thin and the gaps between the coils may be narrow. By using the invention method, the fabrication does not require use of a molding box as does the conventional method and the fabrication is done with simple steps.