The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 1997
Filed:
Apr. 01, 1996
Applicant:
Inventor:
Lai-Juh Chen, Hsin-Chu, TW;
Assignee:
Industrial Technology Research Institute, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
1566361 ; 1566261 ; 216 84 ; 216 88 ; 216 89 ; 216 38 ; 437-8 ; 437225 ;
Abstract
An improved and new process for chemical/mechanical planarization (CMP) of a substrate surface, wherein the endpoint for the planarization process is detected by monitoring the temperature of the polishing pad with an infrared temperature measuring device, has been developed. The process allows endpoint detection in-situ at the polishing apparatus, when polishing to remove a first layer of material and to stop the removal process when a second layer of material is exposed.