Thin packaging of multi-chip modules with enhanced thermal/power

Abstract

A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction, relative to prior art OMPAC devices. The MCM tile includes an interconnection substrate with peripheral metallizations and at least one chip or integrated circuit (IC) mounted on the substrate by solder reflow or conductive adhesive technology. The PWB which may be a single level or a multilevel, is provided with an aperture for accommodation of at least one chip therein. Depending on the type of interconnection between the substrate and the PWB, the aperture may be larger than the substrate of the MCM tile for wire bonding interconnection or smaller than the substrate for solder reflow or conductive adhesive interconnection. In the wire bonding case, the MCM tile is positioned within the aperture resting on the surface of the PWB or of a structural member or of a heat sink which encloses one end of the aperture. The other end of the aperture may be open or enclosed by a structural member, a heat sink, another PWB or a mother board. For solder reflow or conductive adhesive interconnection, the substrate which is larger than the aperture is positioned so that its ends overlap areas of the PWB adjacent the aperture and the chips and/or substrate are positioned within the aperture. The interconnections are enclosed in a compliable encapsulating material, such as silica gel.