The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 1997

Filed:

May. 09, 1995
Applicant:
Inventors:

Christian Val, St Remy les Chevreuse, FR;

Andre Gerard, Viroflay, FR;

Assignee:

Thomson-CSF, Paris, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
29830 ; 29417 ; 29831 ; 29841 ; 216 65 ; 26427214 ;
Abstract

In a method for the interconnection of stacked packages, each of the packages encapsulating, for example, a semiconductor chip containing an integrated circuit, a memory for example, the packages provided with pins are mounted on a printed circuit board. The printed circuit boards are stacked and fixedly joined with one another by means of a coating, for example a resin coating. The stack is sliced through so as to form bars, the pins of the packages being electrically connected to the side surfaces of the bars by means of the tracks of the printed circuit boards. The connection of the packages to one another is done on the side faces of the bars. The bars are then sliced through to obtain unit blocks of stacked packages.


Find Patent Forward Citations

Loading…