The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 1997
Filed:
Nov. 21, 1995
Applicant:
Inventors:
Kazumasa Kimura, Tokyo, JP;
Yasushi Suzuki, Oume, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281101 ; 228111 ; 228212 ;
Abstract
A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of each lead by a bonding tool, catching the irregular portions of the thus made pressure scar by the end of the bonding tool so as to move the free end of the lead towards its fixed end and then bonding the lead to a corresponding pad.
Kimura, Kazumasa. (1997). Single point bonding method (U.S. Patent No. 5634586). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5634586
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile