The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 1997
Filed:
Aug. 17, 1994
John E Lawrence, Cupertino, CA (US);
Kobe Precision, Inc., Hayward, CA (US);
Abstract
A method of reclaiming a substrate wafer and a reclaimed substrate wafer. A semiconductor wafer having external layers from previous processing is reclaimed by etching the external layers and cup-wheel grinding an active surface of the wafer to remove semiconductor components such as diffused regions. Either the active surface or the backside of the wafer is then polished to a mirror finish to provide a highly crystalline surface. The cup-wheel grinding produces a pinwheel surface roughness pattern and is accomplished by grinding the wafer with a cup-shaped grinding wheel having an axis of rotation parallel to but offset from an axis of rotation of the wafer. Preferably, the rim of the cup-shaped grinding wheel always passes over the axis of rotation of the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile