The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 1997
Filed:
Mar. 31, 1995
Alexander Mitwalsky, Poughkeepsie, NY (US);
Katsuya Okumura, Poughkeepsie, NY (US);
Siemens Aktiengesellschaft, Munich, DE;
Kabushiki Kaisha Toshiba, , JP;
Abstract
A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the grooves is forced against the wafer for sawing parallel channels therethrough. A second array of parallel wire saws that are orthogonal to the wires of the first array is provided spaced therefrom for sawing parallel channels through the wafer that are orthogonal to the channels produced by the first array of parallel wire saws.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile