The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 1997

Filed:

Feb. 08, 1995
Applicant:
Inventors:

Yasuyuki Ogata, Saitama-ken, JP;

Yoshimasa Hayashi, Saitama-ken, JP;

Yasushi Kojima, Saitama-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H / ; G04B / ;
U.S. Cl.
CPC ...
333185 ; 501134 ;
Abstract

A composite ceramic material which is available by sintering a mixed powder of a dielectric material and a magnetic material, and contains a third component serving to inhibit a chemical reaction between the dielectric material and the magnetic material during sintering of the mixed powder and reduce the sintering temperature, and particularly, an EMI filter, a composite LC pan and a composite LC chip part made from such a composite ceramic material. The starting end and the terminal end of the inductor are exposed on the both end faces of the bare chip, and signal electrodes are provided at these ends. Ends of the conductors for grounding are exposed on the other both ends of the bare chip, and grounding electrodes are provided at these ends. The conductors for inductor are spirally connected in succession in the thickness direction of the bare chip via throughholes provided in the sheets within the bare chip to form an inductor. The conductors for grounding are adjacent to, and spaced apart by a distance sufficient for insulation from the conductors for inductor in a plane within the bare chip and piled up alternately with the conductors for inductor to form capacitors each between a conductor for grounding and a conductor for the inductor.


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