The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Dec. 21, 1994
Applicant:
Inventors:
Ferruccio Frisina, S. Agata Li Battiati, IT;
Marcantonio Mangiagli, Acireale, IT;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257786 ; 257341 ; 257784 ; 257785 ;
Abstract
An integrated structure pad assembly for wire bonding to a power semiconductor device chip including a chip portion having a top surface covered by a metallization layer which has a first sub-portion wherein functionally active elements of the power device are present. The chip portion has at least one second sub-portion wherein no functionally active elements of the power device are present. The top surface of the at least one second sub-portion is elevated with respect to the first sub-portion to form at least one protrusion which forms a support surface for a wire.